PI Global Investments
Precious Metals

Electrical Characteristics of Ruthenium Tracks with a Cross-Sectional Area Less Than 1000 nm2 | Russian Microelectronics


  • Kapur, P., McVittie, J.P., and Saraswat, K.C., Technology and reliability constrained future copper interconnects. I. Resistance modeling, IEEE Trans. Electron Devices, 2002, vol. 49, no. 4, pp. 590–597. https://doi.org/10.1109/16.992867

    Article 

    Google Scholar
     

  • Gall, D., The search for the most conductive metal for narrow interconnect lines, J. Appl. Phys., 2020, vol. 127, no. 5, p. 050901. https://doi.org/10.1063/1.5133671

    Article 

    Google Scholar
     

  • Kamineni, V., Raymond, M., Siddiqui, S., Mont, F., Tsai, S., Niu, C., Labonte, A., Labelle, C., Fan, S., Peethala, B., Adusumilli, P., Patlolla, R., Priyadarshini, D., Mignot, Y., Carr, A., Pancharatnam, S., Shearer, J., Surisetty, C., Arnold, J., Canaperi, D., Haran, B., Jagannathan, H., Chafik, F., and L’Herron, B., Tungsten and cobalt metallization: A material study for MOL local interconnects, 2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC), San Jose, CA, 2016, IEEE, 2016, pp. 105–107. https://doi.org/10.1109/IITC-AMC.2016.7507698

  • Wen, L.G., Roussel, P., Pedreira, O.V., Briggs, B., Groven, B., Dutta, Sh., Popovici, M.I., Heylen, N., Ciofi, I., Vanstreels, K., Østerberg, F.W., Hansen, O., Petersen, D.H., Opsomer, K., Detavernie, Ch., Wilson, Ch.J., Elshocht, S.V., Croes, K., Bömmels, J., Tőkei, Z., and Adelmann, Ch., Atomic layer deposition of ruthenium with TiN interface for sub-10 nm advanced interconnects beyond copper, ACS Appl. Mater. Interfaces, 2016, vol. 8, no. 39, pp. 26119–26125. https://doi.org/10.1021/acsami.6b07181

    Article 

    Google Scholar
     

  • Fan, S.S.-C., Chen, J.H.-C., Kamineni, V.K., Zhang, X., Raymond, M., and Labelle, C., Middle of line RC performance study at the 7 nm node, 2017 IEEE International Interconnect Technology Conference (IITC), Hsinchu, Taiwan, 2017, IEEE, 2017, pp. 1–3. https://doi.org/10.1109/IITC-AMC.2017.7968960

  • Nogami, T., Patlolla, R., Kelly, J., Briggs, B., Huang, H., Demarest, J., Li, J., Hengstebeck, R., Zhang, X., Lia-n, G., Peethala, B., Bhosale, P., Maniscalco, J., Shobha, H., Nguyen, S., McLaughlin, P., Standaert, T., Canaperi, D., Edelstein, D., and Paruchuri, V., Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines, 2017 IEEE International Interconnect Technology Conference (IITC), Hsinchu, Taiwan, 2017, IEEE, 2017, pp. 1–3. https://doi.org/10.1109/iitc-amc.2017.7968961

  • Wan, D., Paolillo, S., Rassoul, N., Kotowska, B.K., Blanco, V., Adelmann, Ch., Lazzarino, F., Ercken, M., Murdoch, G., Bömmels, J., Wilson, Ch.J., and Tökei, Z., Subtractive etch of ruthenium for sub-5nm interconnect, 2018 IEEE International Interconnect Technology Conference (IITC), Santa Clara, CA, 2018, IEEE, 2018, pp. 10–12. https://doi.org/10.1109/IITC.2018.8454841

  • van der Veen, M.H., Heyler, N., Pedreira, O.V., Ciofi, I., Decoster, S., Gonzalez, V.V., Jourdan, N., Struyf, H., Croes, K., Wilson, C.J., and Tőkei, Zs., Damascene benchmark of Ru, Co and Cu in scaled dimensions, 2018 IEEE International Interconnect Technology Conference (IITC), Santa Clara, CA, 2018, pp. 172–174. https://doi.org/10.1109/IITC.2018.8430407



  • Source link

    Related posts

    Hong Kong Customs Investigates Unregistered Gold Jewelry Cash Transaction Over HK$120,000

    D.William

    XPT Price Analysis Shows Platinum Under Pressure Below $2,000

    D.William

    Tickets Alert: Tours of the London Palladium theatre

    D.William

    Leave a Comment